Substrate transfer system and atmospheric transfer module

ABSTRACT

A substrate transfer system includes a load lock module, an atmospheric transfer module having a first sidewall adjacent to the load lock module and a second sidewall remote from the load lock module, the atmospheric transfer module being connected to the load lock module, and a substrate transfer robot disposed in the atmospheric transfer module. The substrate transfer robot includes a base configured to reciprocate along the first sidewall, a substrate transfer arm disposed on the base, and a flow rectifier surrounding the base, the flow rectifier being configured, upon movement of the base, to create an obliquely downward air flow in a direction opposite to a moving direction of the base.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation application of U.S. application Ser.No. 17/187,299, filed Feb. 26, 2021, which claims priority to JapanesePatent Application No. 2020-035931, filed on Mar. 3, 2020, the entirecontents of which are incorporated herein by reference and priority isclaimed to each.

TECHNICAL FIELD

Various aspects and embodiments of the present disclosure relate to asubstrate transfer system and an atmospheric transfer module.

BACKGROUND

There is known a semiconductor manufacturing apparatus that includes aload lock chamber, a transfer chamber connected to the load lock chamberand configured to transfer a substrate in an atmospheric atmosphere, anda transfer device provided in the transfer chamber (see, for example,Japanese Patent Application Publication No. 2015-18875). The transferdevice is configured to move along a longitudinal direction of thetransfer chamber and transfer the substrate between the load lockchamber and the transfer chamber.

SUMMARY

The present disclosure provides a substrate transfer system and anatmospheric transfer module that can reduce an installation area of asubstrate processing system.

In accordance with an aspect of the present disclosure, there isprovided a substrate transfer system including: a load lock module; anatmospheric transfer module having a first sidewall adjacent to the loadlock module and a second sidewall remote from the load lock module, theatmospheric transfer module being connected to the load lock module; anda substrate transfer robot disposed in the atmospheric transfer module,the substrate transfer robot including: a base configured to reciprocatealong the first sidewall; a substrate transfer arm disposed on the base;and a flow rectifier surrounding the base, the flow rectifier beingconfigured, upon movement of the base, to create an obliquely downwardair flow in a direction opposite to a moving direction of the base.

BRIEF DESCRIPTION OF THE DRAWINGS

The objects and features of the present disclosure will become apparentfrom the following description of embodiments, given in conjunction withthe accompanying drawings, in which:

FIG. 1 is a plan view showing an example of a substrate processingsystem according to a first embodiment;

FIG. 2 shows an example of a cross-sectional view of the substrateprocessing system taken along a dashed dotted line II-II in FIG. 1;

FIG. 3 shows an example of a cross-sectional view of an atmospherictransfer module taken along a dashed dotted line III-III in FIG. 2;

FIG. 4 is a plan view showing an example of an outer shape of a cover ofa transfer robot;

FIG. 5 is a side view showing an example of the transfer robot;

FIG. 6 is a side view showing another example of the transfer robot;

FIG. 7 is a side view showing an example of a transfer robot in which aplurality of blades are provided on a base;

FIG. 8 shows an example of an end effector;

FIG. 9 shows an example of the end effector when transferring an edgering (ER);

FIG. 10 shows an example of the end effector when transferring asubstrate;

FIG. 11 is a plan view showing an example of a substrate processingsystem according to a second embodiment;

FIG. 12 shows an example of a cross-sectional view of the substrateprocessing system taken along a dashed dotted line XII-XII in FIG. 11;

FIG. 13 is a side view showing an example of an aligner module;

FIG. 14 is a plan view showing an example of the aligner module;

FIG. 15 is a plan view showing an example of a positional relationshipbetween the aligner module, the ER, and the end effector when the ER istransferred into the aligner module;

FIG. 16 is a side view showing an example of a positional relationshipbetween the aligner module and the ER when the ER is placed on the liftpins;

FIG. 17 is a side view showing an example of a positional relationshipbetween the aligner module and the ER when the ER is placed on the ERsupport pads;

FIG. 18 shows an example of a change in an amount of light received withrotation of the ER;

FIG. 19 is a plan view showing an example of a positional relationshipbetween the aligner module, the substrate, and the end effector when thesubstrate is transferred into the aligner module;

FIG. 20 is a side view showing an example of a positional relationshipbetween the aligner module and the substrate when the substrate isplaced on the substrate support pads; and

FIG. 21 shows an example of a change in an amount of light received withrotation of the substrate.

DETAILED DESCRIPTION

Hereinafter, embodiments of a substrate transfer system and anatmospheric transfer module will be described in detail with referenceto the accompanying drawings. In addition, the substrate transfer systemand the atmospheric transfer module to be described are not limited bythe following embodiments.

In order to increase the number of substrates that can be processed perunit time, it may be an option to increase the number of processingmodules that process the substrates. However, as the number ofprocessing modules increases, a substrate processing system, whichincludes a plurality of processing modules, a vacuum transfer module, aload lock module, an atmospheric transfer module, and the like, becomeslarger in size. When the size of the substrate processing system isincreased, the installation area (footprint) of the substrate processingsystem in a facility such as a clean room is increased, which makes itdifficult to arrange a plurality of substrate processing systems. Forthat reason, there is a demand for reducing the installation area of thesubstrate processing system.

Accordingly, the present disclosure provides a technique for reducingthe installation area of the substrate processing system.

First Embodiment

(Configuration of the Substrate Processing System 1)

FIG. 1 is a plan view showing an example of the configuration of asubstrate processing system 1 according to a first embodiment. FIG. 2shows an example of a cross-sectional view of the substrate processingsystem 1 taken along a dashed dotted line II-II in FIG. 1. FIG. 3 showsan example of a cross-sectional view of the atmospheric transfer module17 taken along a dashed dotted line III-III in FIG. 2. In FIG. 1, forthe sake of convenience, the internal components of some devices areshown as being visible. The substrate processing system 1 includes amain body 10 and a control device 100 that controls the main body 10.

The main body 10 includes a vacuum transfer module 11, a plurality ofsubstrate processing modules 12, a plurality of load lock modules 13, aplurality of storage modules 14, and a substrate aligner module 15.Further, the main body 10 includes an edge ring (ER) aligner module 16,an atmospheric transfer module 17, and a plurality of load ports 18. Theplurality of substrate processing modules 12 are connected to the vacuumtransfer module 11 via the corresponding gate valves G1. The gate valvesG1 are installed on sidewalls of the vacuum transfer module 11. Theplurality of storage modules 14, the substrate aligner module 15, andthe ER aligner module 16 are connected to the atmospheric transfermodule 17 through the corresponding openings. The openings are formed ina first sidewall 172 of the atmospheric transfer module 17. Further, aFront Opening Unified Pod (FOUP) arranged on each of the plurality ofload ports 18 can be connected to the atmospheric transfer module 17 ata second sidewall 173 of the atmospheric transfer module 17. Theplurality of load lock modules 13 are connected to the vacuum transfermodule 11 via the corresponding gate valves G2 and connected to theatmospheric transfer module 17 via the corresponding gate valves G3. Thegate valves G2 are installed on a sidewall of the vacuum transfer module11, and the gate valves G3 are installed on the first sidewall 172 ofthe atmospheric transfer module 17. That is, the plurality of load lockmodules 13 are fixed to the atmospheric transfer module 17 via thecorresponding gate valves G3.

The gate valves G1 are installed on the sidewalls of the vacuum transfermodule 11, and each gate valve G1 is also installed on the substrateprocessing module 12. In the example of FIG. 1, four substrateprocessing modules 12 are connected to the vacuum transfer module 11.However, the number of substrate processing modules 12 connected to thevacuum transfer module 11 may be three or less, or may be five or more.

Each substrate processing module 12 is configured to perform processingsuch as etching or film formation on the substrate W. In the presentembodiment, the substrate processing module 12 is a plasma processingmodule, and the plasma processing module is configured to perform aplasma processing such as etching and film formation on the substrate Win a vacuum atmosphere. In addition, “vacuum” in the presentspecification may refer to a pressure lower than atmospheric pressureand may be described as “reduced pressure” or “low pressure.” Thesubstrate processing modules may be modules that perform the sameprocessing or different types of processing in a manufacturing process.Each substrate processing module 12 includes a stage on which thesubstrate W is placed, and the stage includes an edge ring (hereinafter,may be referred to as ER) so as to surround the substrate W. Since theER is consumed by the plasma processing, e.g., etching, of the substrateW, the ER is replaced at a predetermined timing.

Further, the plurality of load lock modules 13 are connected to thesidewall of the vacuum transfer module 11 via the gate valves G2. In theexample of FIG. 1, two load lock modules 13 are connected to the vacuumtransfer module 11. However, the number of load lock modules 13connected to the vacuum transfer module 11 may be one, or may be threeor more.

A transfer robot 110 is provided in the vacuum transfer module 11. Thetransfer robot 110 serves as a substrate transfer robot configured totransfer the substrate W between the substrate processing module 12 andthe load lock module 13. The transfer robot 110 also serves as an ERtransfer robot configured to transfer the ER between the substrateprocessing module 12 and the load lock module 13. Therefore, thetransfer robot 110 serving as the substrate transfer robot can furthertransfer the edge ring. The inside of the vacuum transfer module 11 ismaintained at a predetermined pressure (hereinafter, may be referred toas “low pressure”) lower than the atmospheric pressure. In the presentembodiment, the vacuum transfer module 11 is configured to transfer thesubstrate or the edge ring in the vacuum atmosphere. In the presentembodiment, the substrate or the edge ring is transferred between thevacuum transfer module 11 and the substrate processing module 12 by thetransfer robot 110 via the corresponding gate valve G1 in the vacuumatmosphere. In the present embodiment, the substrate or the edge ring istransferred between the vacuum transfer module 11 and the load lockmodule 13 by the transfer robot 110 via the corresponding gate valve G2in the vacuum atmosphere.

Each load lock module 13 is connected to the atmospheric transfer module17 via the corresponding gate valve G3. When the substrate W or the ERis transferred from the atmospheric transfer module 17 into the loadlock module 13 via the gate valve G3, the gate valve G3 is closed andthe pressure in the load lock module 13 is reduced from the atmosphericpressure to the low pressure. Then, the gate valve G2 is opened, and thesubstrate W or the ER in the load lock module 13 is transferred into thevacuum transfer module 11.

Further, when the substrate W or the ER is loaded from the vacuumtransfer module 11 into the load lock module 13 via the correspondinggate valve G2 while the pressure in the load lock module 13 is the lowpressure, the gate valve G2 is closed. Then, the pressure in the loadlock module 13 is increased from the low pressure to the atmosphericpressure. Then, the gate valve G3 is opened, and the substrate W or theER in the load lock module 13 is transferred into the atmospherictransfer module 17.

The plurality of load ports 18 are fixed to the second sidewall 173opposite to the first sidewall 172 to which the load lock modules 13 arefixed (that is, the first sidewall 172 is adjacent to the load lockmodules). Therefore, the atmospheric transfer module 17 has the firstsidewall 172 and the second sidewall 173 opposite to the first sidewall172 (that is, the second sidewall 173 is remote from the load lockmodules), and the load lock modules 13 are fixed to the first sidewall172, and the load ports 18 are fixed to the second sidewall 173 (thatis, the load ports are adjacent to the second sidewall 173). The FOUPaccommodating a plurality of substrates W is connected to each load port18. A FOUP accommodating the ER may be connected to the load port 18.

A transfer robot 20 is provided in the atmospheric transfer module 17.The transfer robot 20 is an example of a substrate transfer robot. Thetransfer robot 20 serves as a substrate transfer robot configured totransfer the substrate W among the FOUPs arranged on the load ports 18,the load lock modules 13, the storage modules 14, and the substratealigner module 15. In addition, the transfer robot 20 also serves as anER transfer robot configured to transfer the ER among the FOUPs arrangedon the load ports 18, the load lock modules 13, and the ER alignermodule 16. Therefore, the transfer robot 20 serving as the substratetransfer robot can further transfer the edge ring. In the presentembodiment, the atmospheric transfer module 17 is configured to transferthe substrate or the edge ring in the atmospheric atmosphere. In thepresent embodiment, the substrate or the edge ring is transferredbetween the FOUPs, the load lock modules 13, the storage modules 14, andthe substrate aligner module 15 by the transfer robot 20 in theatmospheric atmosphere. A guide rail 170 is fixed to the first sidewall172 of the atmospheric transfer module 17 to which the load lock module13 is fixed. In the present embodiment, for example, as shown in FIG. 3,the first sidewall 172 has an upper portion 172 a and a lower portion172 b. A thickness T2 of the lower portion 172 b is smaller than athickness T1 of the upper portion 172 a. The plurality of load lockmodules 13, the plurality of storage modules 14, the substrate alignermodule 15, and the ER aligner module 16 are fixed to the upper portion172 a. The guide rail 170 is fixed to the lower portion 172 b. Thetransfer robot 20 is mounted on a carrier 171 and the carrier 171reciprocates in a moving direction M, which is the direction along theguide rail 170. When the carrier 171 reciprocates in the movingdirection M along the guide rail 170, the transfer robot 20 alsoreciprocates in the moving direction M along the guide rail 170 in theatmospheric transfer module 17.

As described above, in the present embodiment, the guide rail 170 isfixed to the first sidewall 172 to which the load lock module 13 isfixed, and the transfer robot 20 mounted on the carrier 171 reciprocatesin the direction along the guide rail 170. With such a configuration, adrive mechanism for moving the carrier 171 can be disposed at a positionbelow the load lock module 13. In the present embodiment, a distance(for example, the depth dimension shown in FIG. 3) D between the firstsidewall 172 and the second sidewall 173 is, for example, 700 mm orless. Accordingly, the substrate processing system 1 can be reduced insize. Further, by making the lower portion 172 b of the first sidewall172 thinner than the upper portion 172 a of the first sidewall 172, itis possible to suppress the protrusion of the guide rail 170 into theatmospheric transfer module 17. Therefore, the depth dimension D of theatmospheric transfer module 17 can be further reduced. In other words,it is possible to maintain a sufficient transfer space in theatmospheric transfer module 17 without increasing the depth dimension Dof the atmospheric transfer module 17.

Further, in the present embodiment, the transfer robot 20 is movable ata rate of 800 mm/sec or more along the guide rail 170 in the atmospherictransfer module 17. Therefore, the time period required for transferringthe substrate W and the ER can be reduced, and the number of substratesW that can be processed per unit time can be increased.

The substrate aligner module 15 is disposed between one load lock module13 and one storage module 14. Further, the ER aligner module 16 isdisposed between the other load lock module 13 and the other storagemodule 14. In the present embodiment, the storage module 14 and thesubstrate aligner module 15 are disposed adjacent to (on the lateralside of) one load lock module 13 between the substrate processing module12 and the atmospheric transfer module 17, and the storage module 14 andthe ER aligner module 16 are disposed adjacent to (on the lateral sideof) the other load lock module 13 and between the substrate processingmodule 12 and the atmospheric transfer module 17. Therefore, theinstallation area of the substrate processing system 1 can be reduced.

Each storage module 14 temporarily puts an unprocessed substrate W and aprocessed substrate W on standby. The substrate aligner module 15adjusts the orientation of the substrate W transferred into thesubstrate aligner module 15. The orientation-adjusted substrate W istransferred from the substrate aligner module 15 in the atmospherictransfer module 17 by the transfer robot 20, and is transferred from theatmospheric transfer module 17 into the load lock module 13 through thegate valve G3. The ER aligner module 16 adjusts the orientation of thetransferred ER in the ER aligner module 16. The orientation-adjusted ERis transferred from the ER aligner module 16 into the atmospherictransfer module 17 by the transfer robot 20, and is transferred from theatmospheric transfer module 17 into the load lock module 13 through thegate valve G3.

An fan filter unit (FFU) 175 is installed on an upper portion of theatmospheric transfer module 17. The FFU 175 supplies air, from whichparticles and the like are removed (hereinafter referred to as “cleanair”), into the atmospheric transfer module 17 from the upper portion ofthe atmospheric transfer module 17.

A perforated floor 176 is provided at a bottom portion of theatmospheric transfer module 17, and an exhaust device 177 for exhaustingclean air in the atmospheric transfer module 17 is connected to thebottom of the atmospheric transfer module 17 below the perforated floor176. The clean air supplied from the FFU 175 is exhausted by the exhaustdevice 177 through the perforated floor 176, so that a downflow of theclean air is formed in the atmospheric transfer module 17. As a result,it is possible to suppress particles and the like from swirling upwardin the atmospheric transfer module 17. In addition, the exhaust device177 may control a pressure inside the atmospheric transfer module 17such that the interior of the atmospheric transfer module 17 has apositive pressure. As a result, it is possible to suppress externalparticles and the like from entering the atmospheric transfer module 17.

As shown in FIG. 2, for example, the transfer robot 20 has a base 21, atransfer arm 22, an end effector 23, and a cover 24. The base 21 has avertically extending shape and accommodates a drive mechanism such as amotor that drives the transfer arm 22. The base 21 is mounted on thecarrier 171 and moves along the guide rail 170 together with themovement of the carrier 171. The transfer arm 22 moves the end effector23 provided at the tip end thereof. The transfer arm 22 is an example ofa substrate transfer arm. That is, the substrate transfer arm isconfigured to transfer the substrate W. In the present embodiment, thetransfer arm 22 serving as the substrate transfer arm can furthertransfer the edge ring. The end effector 23 holds the substrate W andthe ER. The cover 24 surrounds the base 21. When the base 21 moves alongthe guide rail 170, the cover 24 creates an obliquely downward air flowin a direction opposite to a moving direction of the base 21. The cover24 is an example of a flow rectifier. In the present embodiment, thecover 24 serving as the flow rectifier and the base 21 have beendescribed as separate members that can be separated from each other.However, the present disclosure is not limited thereto. For example, theflow rectifier and the base 21 may be formed as one unit.

The control device 100 includes a memory, a processor, and aninput/output interface. The memory stores data such as recipes, andprograms. For example, the memory may include a random access memory(RAM), a read only memory (ROM), a hard disk drive (HDD), a solid statedrive (SSD), or the like. The processor executes a program read from thememory to control each unit of the main body 10 through the input/outputinterface based on the data such as the recipe stored in the memory. Theprocessor may be a central processing unit (CPU) or a digital signalprocessor (DSP).

(Detailed Configuration of the Cover 24)

FIG. 4 is a plan view showing an example of the outer shape of the cover24 of the transfer robot 20. FIG. 4 shows an example of the outer shapeof the cover 24 when viewed from the top. In the present embodiment, thecover 24 has an inclined side face to be described later. The inclinedside face has a first portion and a second portion. The first portion isformed on a moving direction M1 side of the cover 24, and the secondportion is formed on a moving direction M2 side of the cover 24. Thefirst portion has an outer shape tapering toward the moving direction M1when viewed from the top (in a plan view). In the present embodiment,the first portion has a streamlined outer shape tapering toward themoving direction M1 in a plan view. With such a configuration, when thetransfer robot 20 moves in the moving direction M1 along the guide rail170, an air flow is created in an oblique direction D1 with respect to adirection opposite to the moving direction M1.

Further, in the present embodiment, the second portion has an outershape tapering toward the moving direction M2 when viewed from the top(in a plan view). In the present embodiment, the second portion has astreamlined outer shape tapering toward the moving direction M2 in aplan view. With such a configuration, when the transfer robot 20 movesin the moving direction M2 along the guide rail 170, an air flow iscreated in an oblique direction D2 with respect to a direction oppositeto the moving direction M2.

Accordingly, even when a distance between the first sidewall 172 of theatmospheric transfer module 17 adjacent the load lock module 13 and thesecond sidewall 173 of the atmospheric transfer module 17 opposite tothe first sidewall 172 is shortened, the air turbulence generated by themovement of the transfer robot 20 can be suppressed. Consequently, it ispossible to prevent particles swirling upward in the atmospherictransfer module 17 due to the movement of the transfer robot 20 fromadhering to the substrate W and the ER held by the end effector 23.

FIG. 5 is a side view showing an example of the transfer robot 20. Forexample, as shown in FIG. 5, in the present embodiment, the cover 24 hasan outer shape in which the cross-sectional area increases from thebottom to the top. Further, in the present embodiment, the front side ofthe cover 24 in the moving direction has an inclined face having astraight line obliquely downward with respect to the moving direction asa normal line. In the present embodiment, the cover 24 has an inclinedside face, a bottom, and a top, and the inclined side face flares fromthe bottom to the top in a plan view (top view). As a result, anobliquely downward air flow is created.

In the example of FIG. 5, on the front side of the cover 24 in themoving direction M1, an inclined face having a normal line along adirection D3 obliquely downward with respect to the moving direction M1is formed. Further, on the front side of the cover 24 in the movingdirection M2, an inclined face having a normal line along a direction D4obliquely downward with respect to the moving direction M2 is formed. Inthe present embodiment, the cover 24 has, for example, a truncatedcone-like outer shape. In another embodiment, the cover 24 may have, forexample, a pyramid-like outer shape.

As a result, for example, as shown in FIG. 5, when the transfer robot 20moves in the moving direction M1, an air flow is created along the cover24 in the obliquely downward direction D1 with respect to the directionopposite to the moving direction M1. Further, for example, as shown inFIG. 5, when the transfer robot 20 moves in the moving direction M2, anair flow is created along the cover 24 in the obliquely downwarddirection D2 with respect to the direction opposite to the movingdirection M2. Consequently, it is possible to prevent particles swirlingupward in the atmospheric transfer module 17 due to the movement of thetransfer robot 20 from adhering to the substrate W and the ER held bythe end effector 23.

If the cover 24 has the outer shape tapering toward the moving directionwhen viewed from the top and the cross-sectional area increases from thebottom to the top, the outer shape of the cover 24 is, for example, maybe streamlined as shown in FIG. 6. In this case, the first portion andthe second portion of the inclined side face have a streamlinedprotrusion (streamline nose). FIG. 6 is a side view showing anotherexample of the transfer robot 20.

Further, for example, as shown in FIG. 7, a plurality of blades 25 a and25 b may be provided on the base 21 instead of the cover 24. FIG. 7 is aside view showing an example of the transfer robot 20 in which aplurality of blades 25 are provided on the base 21.

The plurality of blades 25 a are provided on an outer wall of the base21 so as to extend along a direction obliquely downward with respect tothe direction opposite to the moving direction M1. In the example shownin FIG. 7, the plurality of blades 25 a are provided on the front sideof the base 21 and also provided on the back side of the base 21. As aresult, when the transfer robot 20 moves in the moving direction M1, anair flow is created along each blade 25 a in the direction D1 that isobliquely downward with respect to the direction opposite to the movingdirection M1. Further, the front blade 25 a and the back blade 25 a atthe same height may be connected or arranged apart from each other. Thatis, the first portion of the inclined side face may have a plurality ofchevron-shaped blades 25 a vertically arranged and extending alongobliquely downward directions. Further, the first portion of theinclined side face may have a plurality of pairs of vertically arrangedleft and right blades 25 a extending along obliquely downwarddirections.

Further, the plurality of blades 25 b are provided on the outer wall ofthe base 21 so as to extend along a direction obliquely downward withrespect to the direction opposite to the moving direction M2. In theexample shown in FIG. 7, the plurality of blades 25 b are provided onthe front side of the base 21 and also provided on the back side of thebase 21. As a result, when the transfer robot 20 moves in the movingdirection M2, an air flow is created along each blade 25 b in thedirection D2 that is obliquely downward with respect to the directionopposite to the moving direction M2. Further, the front blade 25 b andthe back blade 25 b at the same height may be connected or arrangedapart from each other. That is, the first portion of the inclined sideface may have a plurality of chevron-shaped blades 25 b verticallyarranged and extending along obliquely downward directions. Further, thefirst portion of the inclined side face may have a plurality of pairs ofvertically arranged left and right blades 25 b extending along obliquelydownward directions. Even with such a configuration, it is possible toprevent particles swirling upward in the atmospheric transfer module 17due to the movement of the transfer robot 20 from adhering to thesubstrate W and the ER held by the end effector 23. Alternatively, theouter wall of the cover 24 illustrated in FIG. 5 or 6 may include theplurality of blades 25 a and 25 b illustrated in FIG. 7.

(Structure of the End Effector 23)

FIG. 8 shows an example of the end effector 23. The end effector 23 hasa main body 230, a plurality of ER holding pads 231 and a plurality ofsubstrate holding pads 232. The ER holding pad 231 is an example of theER holding portion, and the substrate holding pad 232 is an example ofthe substrate holding portion.

For example, as shown in FIG. 9, the plurality of ER holding pads 231 isconfigured to hold the ER. For example, as shown in FIG. 10, theplurality of substrate holding pads 232 is configured to hold thesubstrate W, for example, as shown in FIG. Further, the main body 230may include a suction mechanism for the ER that sucks and holds the ERand a suction mechanism for the substrate W that sucks and holds thesubstrate W. As a result, even when the end effector 23 moves at highspeed, the substrate W and the ER can be stably held on the end effector23.

The first embodiment has been described above. As described above, thesubstrate processing system 1 of the present embodiment includes anatmospheric transfer module 17 having a first sidewall 172 and a secondsidewall 173 opposite to the first sidewall 172, the load lock module 13fixed to the first sidewall 172, the load port 18 fixed to the secondsidewall 173, and the transfer robot 20 disposed in the atmospherictransfer module 17. The transfer robot 20 includes a base 21, a transferarm 22, and a cover 24. The base 21 reciprocates along the firstsidewall 172. The transfer arm 22 is installed on the base 21. The cover24 surrounds the base 21 and creates, upon movement of the base 21, anobliquely downward air flow in a direction opposite to the movingdirection of the base 21. Accordingly, even when the distance betweenthe first sidewall 172 and the second sidewall 173 is shortened, the airturbulence generated by the reciprocating movement of the transfer robot20 can be suppressed. Consequently, the atmospheric transfer module 17can be reduced in size while suppressing the upward swirling ofparticles due to the movement of the transfer robot 20. Therefore, theinstallation area of the substrate processing system 1 including theatmospheric transfer module 17 can be reduced.

Further, in the first embodiment described above, the cover 24 has aninclined side face, a bottom, and a top, and the inclined side faceflares from the bottom to the top in a plan view, thereby creating theobliquely downward air flow.

Further, in the first embodiment described above, the inclined side faceof the cover 24 includes a first portion and a second portion oppositeto the first portion in the moving direction, and each of the firstportion and the second portion has an outer shape tapering toward themoving direction in a plan view. Accordingly, when the transfer robot 20moves in the moving direction, an obliquely downward air flow can becreated along the cover 24 in a direction opposite to the movingdirection.

Further, in the first embodiment described above, the flow rectifier maybe a blade 25 extending obliquely downward in a direction opposite tothe moving direction. Even with such a configuration, when the transferrobot 20 moves in the moving direction, an obliquely downward air flowcan be created along the cover 24 in a direction opposite to the movingdirection.

Further, the substrate processing system 1 according to the firstembodiment described above further includes the guide rail 170 disposedin the atmospheric transfer module 17 and fixed to the first sidewall172. The base 21 reciprocates along the guide rail 170. Accordingly, thedrive mechanism for moving the carrier 171 can be disposed below theload lock module 13. As a result, the installation area of the substrateprocessing system 1 can be reduced.

Further, in the first embodiment described above, the first sidewall 172has an upper portion and a lower portion, the load lock module 13 isfixed to the upper portion, and the guide rail 170 is fixed to the lowerportion. Further, the thickness of the lower portion is smaller than thethickness of the upper portion. Accordingly, it is possible to suppressthe protrusion of the guide rail 170 into the atmospheric transfermodule 17. Therefore, it is possible to further reduce the depthdimension of the atmospheric transfer module 17. In other words, it ispossible to maintain a sufficient transfer space in the atmospherictransfer module 17 without increasing the depth dimension of theatmospheric transfer module 17.

Further, in the first embodiment described above, the distance betweenthe first sidewall 172 and the second sidewall 173 is 700 mm or less.Accordingly, the installation area of the substrate processing system 1can be reduced.

Further, in the first embodiment described above, the transfer robot 20is movable at a rate of 800 mm/sec or more. Accordingly, the number ofsubstrates W that can be processed per unit time can be increased.

Further, the substrate processing system 1 according to the firstembodiment described above further includes the substrate aligner module15 fixed to the first sidewall 172, and the substrate aligner module 15is configured to correct the misalignment of the substrate W.Accordingly, the installation area of the substrate processing system 1can be reduced.

Further, the substrate processing system 1 according to the firstembodiment described above further includes the ER aligner module 16fixed to the first sidewall 172, and the ER aligner module 16 isconfigured to correct the misalignment of the ER. The transfer arm 22can further transfer the ER. Accordingly, the installation area of thesubstrate processing system 1 that automatically replaces the ER can bereduced.

Further, in the first embodiment described above, the transfer arm 22has an end effector 23 having an ER holding pad 231 and a substrateholding pad 232. Accordingly, the transfer robot 20 can transfer thesubstrate W and the ER.

Further, the atmospheric transfer module 17 in the first embodimentdescribed above having the first sidewall 172 and the second sidewall173 opposite to the first sidewall 172, and includes the transfer robot20 therein. The transfer robot 20 has the base 21, the transfer arm 22,and the cover 24. The base 21 reciprocates along the first sidewall 172.The transfer arm 22 is installed on the base 21. The cover 24 surroundsthe base 21 and creates, upon the movement of the base 21, an obliquelydownward air flow in a direction opposite to the moving direction of thebase 21. Accordingly, even when the distance between the first sidewall172 and the second sidewall 173 is shortened, the air turbulencegenerated by the movement of the transfer robot 20 can be suppressed.Consequently, the atmospheric transfer module 17 can be reduced in sizewhile suppressing the upward swirling of particles due to the movementof the transfer robot 20. Therefore, the installation area of thesubstrate processing system 1 including the atmospheric transfer module17 can be reduced.

Second Embodiment

In the substrate processing system 1 of the first embodiment, thesubstrate aligner module 15 and the ER aligner module 16 are separatelyprovided. On the other hand, a substrate processing system 1 in thepresent embodiment is provided with one aligner module 30 having thefunctions of the substrate aligner module 15 and the ER aligner module16. Accordingly, the installation area of the substrate processingsystem 1 can be further reduced.

(Configuration of the Substrate Processing System 1)

FIG. 11 is a plan view showing an example of a configuration of thesubstrate processing system 1 according to a second embodiment. FIG. 12shows an example of a cross-sectional view of the substrate processingsystem 1 taken along a dashed dotted line XII-XII in FIG. 11. In FIG.11, some internal components of devices are illustrated transparentlyfor easier understanding. The vacuum transfer module 11 includes a mainbody 10 and a control device 100 that controls the main body 10. Exceptfor the difference described below, in FIG. 11, the components havingthe same reference numerals as those in FIG. 1 have the same or similarfunctions as the components illustrated in FIG. 1, and thus thedescription thereof will be omitted.

The main body 10 includes a vacuum transfer module 11, a plurality ofsubstrate processing modules 12, a plurality of load lock modules 13, aplurality of storage modules 14, an atmospheric transfer module 17, aplurality of load ports 18, and an aligner module 30.

In the present embodiment, the plurality of storage modules 14 aredisposed adjacent to (on the lateral side of) one load lock module 13.Further, the aligner module 30 is disposed between the other load lockmodule 13 and the other storage module 14.

The aligner module 30 is configured to adjust the orientation of thesubstrate W transferred into the aligner module 30. Theorientation-adjusted substrate W is transferred from the aligner module30 by the transfer robot 20 into the load lock module 13 through thegate valve G3. Further, the aligner module 30 is further configured toadjust the orientation of the ER transferred into the aligner module 30.The orientation-adjusted ER is transferred from the aligner module 30 bythe transfer robot 20 into the load lock module 13 through the gatevalve G3.

(Structure of the Aligner Module 30)

FIG. 13 is a side view showing an example of the aligner module 30, andFIG. 14 is a plan view showing an example of the aligner module 30. Thealigner module 30 includes a mounting base 31, a rotor 32, a pluralityof ER support pads 33, a plurality of substrate support pads 34, aplurality of lift pins 35, a light emitting unit 36, and a lightreceiving unit 37. The ER support pad 33 is an example of the ERsupport, and the substrate support pad 34 is an example of the substratesupport. The light receiving unit 37 is an example of a determiner.

The rotor 32 is provided on the mounting base 31. The plurality of ERsupport pads 33 and the plurality of substrate support pads 34 areprovided on the rotor 32. The rotor 32 is rotated by a drive mechanism(not shown) provided in the mounting base 31. As the rotor 32 isrotated, the plurality of ER support pads 33 and the plurality ofsubstrate support pads 34 are also rotated. The plurality of lift pins35 is raised and lowered by a drive mechanism (not shown) provided inthe mounting base 31. The rotor 32, each ER support pad 33, and eachlift pin 35 are provided at positions that do not interfere with the endeffector 23 when the end effector 23 on which the substrate W or the ERis placed is introduced into the aligner module 30.

The light emitting unit 36 is a light source that irradiates lighttoward the light receiving unit 37. The light emitting unit 36 may be,for example, a light emitting diode (LED) or a semiconductor laser. Thelight receiving unit 37 detects the amount of light emitted from thelight emitting unit 36 and outputs the detected amount of light to thecontrol device 100. The light receiving unit 37 may be, for example, aline sensor such as a charge coupled device (CCD) or a complementarymetal oxide semiconductor (CMOS).

(Procedure for Correcting the Positional Misalignment of the ER)

Hereinafter, the procedure when the positional misalignment of the ER iscorrected in the aligner module 30 will be described with reference toFIGS. 15 to 18.

First, for example, as shown in FIG. 15, the end effector 23 on whichthe ER is placed is introduced into the aligner module 30 in a statewhere the lift pins 35 are raised. The ER has an oriental flat (OF) thatis a shape that serves as a reference for the position of the ER.

Next, when the end effector 23 is lowered, the ER placed on the endeffector 23 is placed on the lift pins 35, for example, as shown in FIG.16. Then, the end effector 23 is retracted to the outside of the alignermodule 30.

Then, when the lift pins 35 are lowered, the ER is placed on the ERsupport pads 33, for example, as shown in FIG. 17. Then, the rotor 32 isrotated to rotate the ER placed on the ER support pads 33. Then, thelight emitting unit 36 irradiates the light toward the light receivingunit 37, and the amount of light detected by the light receiving unit 37is output to the control device 100.

Here, in a case where the ER does not have the OF, if the rotation axisof the rotor 32 and the rotation axis of the ER are misaligned, theamount of light detected by the light receiving unit 37 as the ERrotates varies as shown by a curve L1 of FIG. 18, for example. Thevariable amplitude of the curve L1 depends on the magnitude of themisalignment between the rotation axis of the rotor 32 and the rotationaxis of the ER.

In a case where the ER has the OF, the amount of light actually detectedby the light receiving unit 37 varies as shown by a curve L2 of FIG. 18,for example. In the curve L2, a portion surrounded by a broken lineindicates a change in the amount of light when the OF passes between thelight emitting unit 36 and the light receiving unit 37. The controldevice 100 determines the direction and magnitude of the misalignment ofthe ER based on the variable amplitude of the amount of light and therotation angle of the ER when the OF passes between the light emittingunit 36 and the light receiving unit 37.

Next, when the lift pins 35 are raised, the ER is placed on the liftpins 35. Then, the control device 100 controls the transfer robot 20 sothat the end effector 23 is introduced and positioned at a positioncorresponding to the determined direction and magnitude of themisalignment of the ER. Then, when the end effector 23 is raised, the ERis placed on the end effector 23. Thus, the positional misalignment ofthe ER can be corrected.

(Procedure for Correcting the Positional Misalignment of the SubstrateW)

Hereinafter, the procedure when the positional misalignment of thesubstrate W is corrected in the aligner module 30 will be described withreference to FIGS. 19 to 21.

First, for example, as shown in FIG. 19, the end effector 23 on whichthe substrate W is placed is introduced into the aligner module 30 in astate where the lift pins 35 are lowered. The substrate W has a notch(NC) that is a shape that serves as a reference for the position of thesubstrate W.

Next, when the end effector 23 is lowered, the substrate W placed on theend effector 23 is placed on the substrate support pads 34, for example,as shown in FIG. 20. Then, the end effector 23 is retracted to theoutside of the aligner module 30.

Next, the rotor 32 is rotated to rotate the substrate W placed on thesubstrate support pads 34. Then, the light emitting unit 36 irradiatesthe light toward the light receiving unit 37, and the amount of lightdetected by the light receiving unit 37 is output to the control device100.

Here, in a case where the substrate W does not have the NC, if therotation axis of the rotor 32 and the rotation axis of the substrate Ware misaligned, the amount of light detected by the light receiving unit37 as the substrate W rotates varies as shown by a curve L3 of FIG. 21,for example. The variable amplitude of the curve L3 depends on themagnitude of the misalignment between the rotation axis of the rotor 32and the rotation axis of the substrate W.

In a case where the substrate W has the NC, the amount of light actuallydetected by the light receiving unit 37 varies as shown in a curve L4 ofFIG. 21, for example. In the curve L4, a portion surrounded by a brokenline indicates a change in the amount of light when the NC passesbetween the light emitting unit 36 and the light receiving unit 37. Thecontrol device 100 determines the direction and magnitude of themisalignment of the substrate W based on the variable amplitude of theamount of light and the rotation angle of the substrate W when the NCpasses between the light emitting unit 36 and the light receiving unit37.

Next, the control device 100 controls the transfer robot 20 so that theend effector 23 is introduced and positioned at a position correspondingto the determined direction and magnitude of the misalignment of thesubstrate W. Then, when the end effector 23 is raised, the substrate Wis placed on the end effector 23. Thus, the positional misalignment ofthe substrate W can be corrected.

The second embodiment has been described above. As described above, thesubstrate processing system 1 of the present embodiment includes analigner module 30 connected to the first sidewall 172 of the atmospherictransfer module 17 adjacent to the load lock module 13. The alignermodule 30 has a function of correcting the positional misalignment ofthe substrate W and a function of correcting the positional misalignmentof the ER. The transfer arm 22 can further transfers the ER. As aresult, the installation area of the substrate processing system 1 canbe further reduced.

Further, in the second embodiment described above, the aligner module 30has the rotor 32, the ER support pads 33, the substrate support pads 34,the lift pins 35, and the light receiving unit 37. The lift pins 35receive the ER from the transfer arm 22 that serves as the substratetransfer arm. In other words, the transfer arm 22 serving as thesubstrate transfer arm transfers the ER from the atmospheric transfermodule 17 to the aligner module 30, and places the ER, which is placedon the transfer arm 22, on the lift pins 35. The ER support pads 33receive the ER from the lift pins 35 to support the ER. The substratesupport pads 34 receive the substrate W from the transfer arm 22. Inother words, the transfer arm 22 serving as the substrate transfer armtransfers the substrate W from the atmospheric transfer module 17 to thealigner module 30, and places the substrate W, which is placed on thetransfer arm 22, on the substrate support pads 34. The rotor 32 rotatesthe ER support pads 33 and the substrate support pads 34. Accordingly,the ER on the ER support pads 3 and the substrate W on the substratesupport pads 34 are rotated. The light receiving unit 37 detects areference shape (notch) of the substrate W on the substrate support pads34 while the substrate support pads 34 are rotated by the rotor 32.Further, the light receiving unit 37 detects a reference shape (orientalflat) of the ER on the ER support pads 33 while the ER support pads 33are rotated by the rotor 32. Thus, the positional misalignment of thesubstrate W and the positional misalignment of the ER can be corrected.

The presently disclosed embodiments are considered in all respects to beillustrative and not restrictive. The above-described embodiments can beembodied in various forms. Further, the above-described embodiments maybe omitted, replaced, or changed in various forms without departing fromthe scope of the appended claims and the gist thereof.

1. A transfer system comprising: a load lock module; an atmospherictransfer module connected to the load lock module; a substrate transferrobot configured to simultaneously or separately transfer a substrateand an edge ring in the atmospheric transfer module; and an alignermodule connected to the atmospheric transfer module, the aligner modulebeing configured to correct misalignment of the substrate andmisalignment of the edge ring.
 2. The transfer system of claim 1,wherein the aligner module includes: a rotating unit having a ringsupport; a driving unit configured to rotate the rotating unit; and adetector configured to detect a reference shape of the edge ring duringwhich the edge ring on the ring support is rotated by rotation of therotating unit.
 3. The transfer system of claim 2, wherein the rotatingunit further has a substrate support, and the detector is furtherconfigured to detect a reference shape of the substrate during which thesubstrate on the substrate support is rotated by rotation of therotating unit.
 4. The transfer system of claim 3, wherein the referenceshape of the edge ring is an oriental flat, and the reference shape ofthe substrate is a notch.
 5. The transfer system of claim 4, wherein thedetector includes: a light emitting unit configured to radiate a lightin a vertical direction, and a light receiving unit disposed above orbelow the light emitting unit and configured to receive the light fromthe light emitting unit.
 6. The transfer system of claim 5, furthercomprising a controller configured to determine a direction and amagnitude of the misalignment of the edge ring based on an amplitude ofthe received light and a rotation angle of the edge ring.
 7. Thetransfer system of claim 6, wherein the controller is further configuredto determine a direction and a magnitude of the misalignment of thesubstrate based on an amplitude of the received light and a rotationangle of the substrate.
 8. The transfer system of claim 1, wherein thealigner module is disposed adjacent to the load lock module.
 9. Thetransfer system of claim 1, further comprising a vacuum transfer moduleconnected to the load lock module; a substrate processing moduleconnected to the vacuum transfer module, wherein the aligner module isdisposed between the atmospheric transfer module and the substrateprocessing module.
 10. The transfer system of claim 1, furthercomprising a guide rail fixed to a sidewall of the atmospheric transfermodule, wherein the substrate transfer robot is movable along the guiderail.
 11. An aligner module comprising: a rotating unit having a bodyand a plurality of ring supporting portions extending from the body tooutward; a driving unit configured to rotate the rotating unit; adetector configured to detect a reference shape of the edge ring duringwhich the edge ring on the plurality of ring supporting portions isrotated by rotation of the rotating unit; and a controller configured tocorrect misalignment of the edge ring based on a rotation angle of theedge ring when the reference shape of the edge ring is detected by thedetector.
 12. The aligner module of claim 11, wherein an upper surfaceof the body serves as a substrate support, and the detector is furtherconfigured to detect a reference shape of the substrate during which thesubstrate on the substrate support is rotated by rotation of therotating unit.
 13. The aligner module of claim 12, wherein the detectorincludes: a light emitting unit configured to radiate a light in avertical direction, and a light receiving unit disposed above or belowthe light emitting unit and configured to receive the light from thelight emitting unit.